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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
Описание
(Wiley - IEEE) 1st Edition
by Lih-Tyng Hwang (Author), Tzyy-Sheng Jason Horng (Author)
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
- Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
- Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
- Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
- Provides chapter-wise review questions and powerpoint slides as teaching tools
Детали
Year:
2018
Pages:
450
Language:
English
Format:
PDF
Size:
11.5 MB
ISBN-10:
1119289645
ISBN-13:
978-1119289647
ASIN:
B07BYSK7GT
